WebFeb 15, 2024 · Extremely hard semiconductor substrates, including sapphire, SiC, and diamond, have been widely used in the semiconductor field in recent decades. Extremely hard semiconductor substrates with ultra-smooth and low-defect density surfaces are application prerequisites. Chemical mechanical polishing (CMP) and fixed abrasive … WebThe thinning may, for example, be achieved using conventional techniques such as, for example, grinding and/or polishing and/or etching and/or CMP (chemical mechanical polishing).In this connection, a lower side of the vias (through-contacts) 103 may, for example, be used for end-point detection.
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